Use of Soldered or Glued PCSB as Interconnection between PCB and Ceramic Package in Harsh Environment
Category
Lecture
Language
English
Author(s)
- Jakob Gakkestad
- Ottar Opland
- Per G. dalsjø
- Susanne Helland
- Helge Kristiansen
- Maaike Margrete Visser Taklo
- Daniel Nilsen Wright
Affiliation
- Norwegian Defence Research Establishment
- Unknown
- SINTEF Digital / Smart Sensors and Microsystems
Presented at
2016 IMAPS Nordic Conference
Place
Tønsberg
Date
05.06.2016 - 07.06.2016
Organizer
IMAPS