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3D Integration of MEMS and IC: Design, technology and simulations

Abstract

* 3D integration: Opportunities and trends* e-CUBES: Tire pressure monitoring system (TPMS)* Package design including thermo-mechanical modeling* Technology development* Sensor packaging concept* Gold stud bump bonding* Device characterization and testing* Summary and outlook

Category

Academic lecture

Language

English

Author(s)

  • Kari Schjølberg-Henriksen

Affiliation

  • SINTEF Digital / Microsystems and Nanotechnology

Presented at

Advanced materials and technologies for micro/nano-devices, sensors and actuators

Place

St. Petersburg, Russia

Date

29.06.2009 - 02.07.2009

Year

2009

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