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Smart Inspection System for High Speed and Multifunctional Testing of MEMS and MOEMS

Smart Inspection System for High Speed and Multifunctional Testing of MEMS and MOEMS

Category
Academic lecture
Abstract
SMARTIEHS develops a major breakthrough in M(O)EMS testing innovative test concept parallel inspection of 100 M(O)EMS structures on the wafer level high-speed inspection measurement time can be reduced by a factor of 100 multi-functional approach exchangeable probing wafer enable a wide range of test parameters in the same instrument
Language
English
Author(s)
Affiliation
  • SINTEF Digital / Smart Sensor Systems
  • SINTEF Digital
Presented at
MEMSWAVE 2008 RF-MST Workshop
Place
Heraklion, Kreta
Date
30.06.2008 - 30.06.2008
Organizer
European Commision
Year