Thermomechanical reliability of gold stud bump bonding for large volume MEMS devices
Category
Conference lecture
Language
English
Author(s)
- Maaike Margrete Visser Taklo
- Daniel Nilsen Wright
- Astrid-Sofie Vardøy
- Alastair Attard
- Zlatko Hajdarevic
- Stephan Bulacher
- Mario Saliba
- Jan Wijgaerts
- Joshua Borg
- David Oscar Vella
Affiliation
- SINTEF Digital / Smart Sensors and Microsystems
- Belgium
- Malta
- Austria
Presented at
Electronic Components and Technology Conference (ECTC) , 2015 IEEE 65th
Place
San Jose
Date
26.05.2015 - 29.05.2015
Organizer
IEEE
Year
2015View this publication at Norwegian Research Information Repository