Systematic characterization of key parameters of hermetic waferlevel Cu-Sn SLID bonding
Category
Academic lecture
Language
English
Author(s)
- H. J. van de Wiel
- Astrid-Sofie Vardøy
- G. Hayes
- M.H.M. Kouters
- Adri van der Waal
- M. Erinc
- Adriana Lapadatu
- Stian Martinsen
- Maaike Margrete Visser Taklo
- H.R. Fischer
Affiliation
- Unknown
- SINTEF Digital / Smart Sensors and Microsystems
- Norwegian University of Science and Technology
Presented at
European Microelectronics and Packaging Conference
Place
Grenoble
Date
09.09.2013 - 12.09.2013
Organizer
iMAPS