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Residual stress in silicon caused by Cu-Sn wafer-level packaging

Category

Academic lecture

Language

English

Author(s)

  • Maaike Margrete Visser Taklo
  • Astrid-Sofie Vardøy
  • Ingrid De Wolf
  • Veerle Simons
  • H. J. van de Wiel
  • Adri van der Waal
  • Adriana Lapadatu
  • Stian Martinsen
  • Bernhard Wunderle

Affiliation

  • SINTEF Digital / Smart Sensor Systems
  • Interuniversity Microelectronics Center
  • Netherlands Organisation for Applied Scientific Research
  • SensoNor ASA
  • Norwegian University of Science and Technology
  • Chemnitz University of Technology

Presented at

InterPACK2013-73317

Place

Burlingame

Date

16.07.2013 - 18.07.2013

Organizer

ASME

Year

2013

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