Residual stress in silicon caused by Cu-Sn wafer-level packaging
Category
Conference lecture
Language
English
Author(s)
- Maaike Margrete Visser Taklo
- Astrid-Sofie Vardøy
- Ingrid De Wolf
- Veerle Simons
- H. J. van de Wiel
- Adri van der Waal
- Adriana Lapadatu
- Stian Martinsen
- Bernhard Wunderle
Affiliation
- SINTEF Digital / Smart Sensors and Microsystems
- Interuniversity Microelectronics Center
- Netherlands Organisation for Applied Scientific Research
- Chemnitz University of Technology
- Norwegian University of Science and Technology
- SensoNor ASA
Presented at
InterPACK2013-73317
Place
Burlingame
Date
16.07.2013 - 18.07.2013
Organizer
ASME
Year
2013View this publication at Norwegian Research Information Repository