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High temperature reliability of aluminium wire-bonds to thin film, thick film and low temperature co-fired ceramic (LTCC) substrate metallization

Category

Academic article

Language

English

Author(s)

Affiliation

  • SINTEF Digital / Smart Sensor Systems

Year

2008

Published in

Microelectronics and reliability

ISSN

0026-2714

Volume

48

Issue

10

Page(s)

1711 - 1719

View this publication at Cristin