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Characterization of hermetic wafer-level Cu-Sn SLID bonding

Category

Academic chapter/article/Conference paper

Language

English

Author(s)

  • Hubertus Johannes van de Wiel
  • Astrid-Sofie Vardøy
  • Gregory Hayes
  • Hartmut Fischer
  • Adriana Lapadatu
  • Maaike Margrete Visser Taklo

Affiliation

  • Netherlands Organisation for Applied Scientific Research
  • SINTEF Digital / Smart Sensor Systems
  • SensoNor ASA

Year

2012

Publisher

IEEE conference proceedings

Book

4th Electronics System-Integration Technology Conference (ESTC 2012)

ISBN

978-1-4673-4645-0

View this publication at Cristin