Characterization of hermetic wafer-level Cu-Sn SLID bonding
Category
Academic chapter
Language
English
Author(s)
- Hubertus Johannes van de Wiel
- Astrid-Sofie Vardøy
- Gregory Hayes
- Hartmut Fischer
- Adriana Lapadatu
- Maaike Margrete Visser Taklo
Affiliation
- SINTEF Digital / Smart Sensors and Microsystems
- Netherlands Organisation for Applied Scientific Research
- SensoNor ASA
Year
2012Publisher
IEEE (Institute of Electrical and Electronics Engineers)
Book
4th Electronics System-Integration Technology Conference (ESTC 2012)
ISBN
9781467346450
View this publication at Norwegian Research Information Repository