Abstract
Corrosion-induced degradation (CID) of aluminum conductors has been linked to the weakening of semiconductive screens in wet-design power cables, where micro-cracks initiate at corrosion sites and may subsequently serve as precursors for water tree initiation in the insulation. It has been proposed that fracture of the corrosion layer under mechanical stress can tear portions of the semiconductor, further promoting crack formation and facilitating moisture ingress. The objective of this work is to reproduce, using model systems, the mechanisms by which CID leads to micro-cracking and early-stage water tree growth, and to assess how different aluminum alloys influence the severity of these effects. For the first time, the characteristic CID features observed in service-aged cables were successfully replicated in small-scale Rogowski model objects, yielding microstructural damage closely resembling that found in field samples. This achievement enables systematic laboratory investigation of CID-induced semiconductor failure and provides a foundation for evaluating alloy-dependent resilience and mitigation strategies for improved cable durability.