Abstract
This paper discusses the integration and testing of micro-electro-mechanical systems (MEMS)-based microplasma devices with low-volume flow cells at the PCB level for emission spectroscopy of volatile organic compounds (VOCs). We introduced a novel bonding process that ensures a tight gas seal, stable pressure control down to 150 mbar, and the exchange of top fluidic glass substrates to assess their influence on the emission spectrum. The bonding process facilitates the assembly of pre-packaged MEMS components for reconfigurable and repeatable gas exposure experiments.