Publications
- Characterisation of thermocompression bonds formed using metal coated polymer core particles for fine pitch interconnections
- Cost-Efficient Wafer-Level Capping for MEMS and Imaging Sensors by Adhesive Wafer Bonding
- Dry-film resist technology for versatile TSV fabrication for MEMS, tested on blind dummy TSVs
- Results from the first prototype of large 3D active edge sensors
- TSV development for miniaturized MEMS acceleration switch Read the publication
- Results from the First Prototype of Large 3D Active Edge Sensors
- Etching Burried Oxide at the Bottom of High Aspect Ratio Structures Read the publication
- Electrical Characterization and Preliminary Beam Test Results of 3D Silicon CMS Pixel Detectors Read the publication
- The SiRi particle-telescope system Read the publication
- 3D-FBK pixel sensors: Recent beam tests results with irradiated devices
Other
- Thinned Commercial Foundry-built High Energy Physics Sensors using Microwave Anneal
- Status of 3D detector development at SINTEF for ITk Upgrade
- Dry-film resist technology for versatile TSV fabrication for MEMS, tested on blind dummy TSVs
- Reliability of TSV and wafer-level bonding for a 3D integrable SOI based MEMS application
- Wafer-level Bonding using Anisotropic Conductive Adhesive for 3D MEMS Applications
- Wafer-level Bonding using Anisotropic Conductive Adhesive for 3D MEMS applications
- Etching buried oxide at the bottom of high aspect ratio structures Read the publication
- Fabrication of Full 3D Active Edge Sensors
- Wafer-level packaged MEMS switch with TSV Read the publication
- Status of 3D sensors processing at SINTEF MiNaLab