The MEMS-pie project:
Piezoelectric microsystems from the laboratory to production


  Sixth Framework Programme


Testing and characterisation

Automated poling and testing

A system for automated poling and testing of the devices at wafer level has been developed. The wafer is mounted on a programmable xyz-table with a heating chuck. The devices are addressed sequentially and can be poled and tested individually at up to 160 °C. C(V) and I(V) measurements are routinely carried out and the system is to be integrated with an aixACCT TF2000 ferroelectric analyzer that will enable automatic measurements, including:
• polarisation hysteresis,
• fatigue behaviour,
• impedance sweeps (for electromechanical characterisation including determination of mechanical resonances).

New testing method

The project has developed a new 4-point bending set-up for measurement of piezoelectric and dielectric charges at a substrate that is bent into a constant curvature [1]. The bending amplitude is measured by an interferometer and is used for determining the transversal piezoelectric charge coefficient, e31,f. Samples for this test set-up have been included in the test wafer. The same set-up and samples can also be used for d33 measurements.


Automated probe station for automatic poling and mapping of device performance across a wafer

Published February 10, 2006

These web pages do not represent the opinion of the European Community and the Community is not responsible for any use that might be made of data appearing in them.