Sixth Framework Programme
Test wafer (100 mm diameter) after processing. The wafer contains more than 500 piezoelectric test devices.
Based on the results from the MEMS-pie project, the partners are able to offer assistance in all the phases required to realise new piezo-MEMS devices;
• Concept evaluation• Modelling and design• Assessment of processing routes• Wafer-level processing in clean-room• Wafer-level testing and verification
Henrik RaederResearch Manager, SINTEFMEMS-pie CoordinatorPhone: +47 977 14 975E-mail: Henrik.Raeder@sintef.no
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