Sixth Framework Programme
Automated poling and testingA system for automated poling and testing of the devices at wafer level has been developed. The wafer is mounted on a programmable xyz-table with a heating chuck. The devices are addressed sequentially and can be poled and tested individually at up to 160 °C. C(V) and I(V) measurements are routinely carried out and the system is to be integrated with an aixACCT TF2000 ferroelectric analyzer that will enable automatic measurements, including:
Published October 26, 2006
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