Test production Qualified procedures are developed through processing and analysis of test wafers. The test wafer design contains more than 500 device elements of sizes between 10 µm and 1 mm. The device elements are cantilevers, plates, bridges and fixed membranes.
Design overview of the test wafer developed by the project. Twelve 15x15 mm squares contain a large number of basic design elements. Eight rectangles are dedicated to four-point bending tests to be performed after dicing of the wafer.
Piezoelectric MEMS devices are produced through a series of deposition and etching steps.
Automated poling and testing A system for automated poling and testing of the devices at wafer level has been developed. The wafer is mounted on a programmable xyz-table with a heating chuck. The devices are addressed sequentially and can be poled and tested individually at up to 160 °C. C(V) and I(V) measurements are routinely carried out and the system is to be integrated with an aixACCT TF2000 ferroelectric analyzer that will enable automatic measurements, including:
impedance sweeps (for electromechanical characterisation including determination of mechanical resonances).
Photograph of mounted cantilever elements after processing
Automated probe station for automatic poling and mapping of device performance across a wafer.
Published October 26, 2006
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