To main content

Daniel Nilsen Wright

Research Scientist

Daniel Nilsen Wright

Research Scientist

Daniel Nilsen Wright
Phone: +47 934 41 038
Mobile: +47 934 41 038
Department: Smart Sensor Systems
Office: Oslo

Publications and responsibilities

Publications

Publication

Characterization of B-implanted 3C-SiC for intermediate band solar cells

http://www.sintef.no/en/publications/publication/?pubid=CRIStin+1503792

Sublimation-grown 3C-SiC crystals were implanted with B ions at elevated temperature (400 °C) using multiple energies (100 to 575 keV) with a total dose of 1.3×1017 atoms/cm2 in order to form intermediate band (IB) in 3C-SiC. The samples were then annealed at 1400 °C for 60 min. An anomalous area in...

Authors Ma Quanbao Carvalho Patricia Galeckas Augustinas Azarov Alexander Hovden Sigurd Slettemark Thøgersen Annett Wright Daniel Nilsen Diplas Spyridon Løvvik Ole Martin Jokubavicius Valdas Sun Jianwu Syväjärvi Mikael Svensson Bengt Gunnar
Year 2017
Type Journal publication
Publication

Soldering of components onto a smart tag - an evaluation of the process window

http://www.sintef.no/en/publications/publication/?pubid=CRIStin+1479622

An experiment was designed using optimal design of experiments to identify the most relevant parameters in an assembly step for a smart tag; the soldering of 0402 resistors to a polyimide backplane. The parameter window was set to reflect natural variations in production, and parameter variations we...

Authors Vardøy Astrid-Sofie Borge Garcia Alexandre Wright Daniel Nilsen Belle Branson Taklo Maaike M. Visser Hagel Olle Xie Li Danestig Magnus Eriksson Torbjörn
Year 2017
Type Conference lecture and academic presentation
Publication

Hygrothermal aging of flip-chip assembled MOEMS

http://www.sintef.no/en/publications/publication/?pubid=CRIStin+1458002

A flip-chip version of an optical MEMS (MOEMS) assembly is demonstrated in this work. A dummy MOEMS device is attached directly onto a traditional FR-4 board using a novel isotropic conductive adhesive (ICA) in order to minimize both fabrication costs and footprint of the assembly. The assembly solu...

Authors Taklo Maaike M. Visser Wright Daniel Nilsen Kolberg Sigbjørn Vardøy Astrid-Sofie Borge Hamou Faycal Riad Vogl Andreas Bakke Thor Kristiansen Helge Kalland Erik
Year 2017
Type Conference lecture and academic presentation
Publication

Smart Tags that are exactly Reliable Enough

http://www.sintef.no/en/publications/publication/?pubid=CRIStin+1450852

Smart tags for fast moving consumer goods are among the products predicted to be part of the Internet of Everything. The tags must be extremely low cost, be fabricated in huge volumes, and have a quality accepted by the end user. Screening tests have been performed to evaluate technologies for hybri...

Authors Taklo Maaike M. Visser Belle Branson Wright Daniel Nilsen Vardøy Astrid-Sofie Borge Garcia Alexandre Eriksson Torbjörn Hagel Olle Danestig Magnus
Year 2017
Type Part of a book/report
Publication

Reliability of Plastic Core Solder Balls in relation to formation of intermetallic compounds

http://www.sintef.no/en/publications/publication/?pubid=CRIStin+1438543

The application of plastic core solder balls (PCSB) for the assembly of a silicon (Si) interposer die inside a ceramic package has been evaluated for a harsh application. Three different variants of assembly were compared. All variants survived the performed thermal shock cycling and centrifugation....

Authors Taklo Maaike Margrete Visser Wright Daniel Nilsen Graff Joachim Seland Carvalho Patricia Austad Hanne Opsahl Dalsjø Per G. Gakkestad Jakob Ishida Hiroya Johnsen Christian
Year 2016
Type Part of a book/report
Publication

All-Copper Flip Chip Interconnects by Pressureless and Low Temperature Nanoparticle Sintering

http://www.sintef.no/en/publications/publication/?pubid=CRIStin+1413917

Flip chip interconnects purely made out of Cu, so-called all-Cu interconnects, have the potential to overcome the present current capacity limit of state-of-the-art solder based interconnects, while meeting the demand for ever decreasing interconnect pitches. Parasitic effects in solder based interc...

Authors Zürcher Jonas Del Carro Luca Schlottig Gerd Wright Daniel Nilsen Vardøy Astrid-Sofie Borge Taklo Maaike Margrete Visser Mills Tobias Zschenderlein Uwe Wunderle Bernhard Brunschwiler Thomas
Year 2016
Type Part of a book/report
View all publications at Cristin