publications and responsibilities
Hygrothermal aging of flip-chip assembled MOEMS
A flip-chip version of an optical MEMS (MOEMS) assembly is demonstrated in this work. A dummy MOEMS device is attached directly onto a traditional FR-4 board using a novel isotropic conductive adhesive (ICA) in order to minimize both fabrication costs and footprint of the assembly. The assembly solu...
Cost-Efficient Wafer-Level Capping for MEMS and Imaging Sensors by Adhesive Wafer Bonding
Device encapsulation and packaging often constitutes a substantial part of the fabrication cost of micro electro-mechanical systems (MEMS) transducers and imaging sensor devices. In this paper, we propose a simple and cost-effective wafer-level capping method that utilizes a limited number of highly...
Applications of PZT-based micromirrors
PiezoMEMS development from idea to product - case examples from SINTEF
Piezoelectric thin film materials for MEMS
Multiphysics Modeling & Simulation of Microsystems at SINTEF ICT - MiNaLab
Micro-device design, modelling and simulation are important aspects of our work at SINTEF-MiNaLab. Due to the rapid progress in the manufacturing of miniaturized smart microsystems, the numerical simulation tasks are essential steps in making predictions before experiments are done, as well as inter...