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Andreas Vogl

Senior Scientist

Andreas Vogl

Senior Scientist

Andreas Vogl
Phone: 924 08 212
Mobile: 924 08 212
Department: Microsystems and Nanotechnology
Office: Oslo

publications and responsibilities



Hygrothermal aging of flip-chip assembled MOEMS

A flip-chip version of an optical MEMS (MOEMS) assembly is demonstrated in this work. A dummy MOEMS device is attached directly onto a traditional FR-4 board using a novel isotropic conductive adhesive (ICA) in order to minimize both fabrication costs and footprint of the assembly. The assembly solu...

Year 2017
Type Presentation

Cost-Efficient Wafer-Level Capping for MEMS and Imaging Sensors by Adhesive Wafer Bonding

Device encapsulation and packaging often constitutes a substantial part of the fabrication cost of micro electro-mechanical systems (MEMS) transducers and imaging sensor devices. In this paper, we propose a simple and cost-effective wafer-level capping method that utilizes a limited number of highly...

Authors Bleiker Simon J. Taklo Maaike M Visser Lietaer Nicolas Vogl Andreas Bakke Thor Niklaus Frank
Year 2016
Type Journal article
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