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PIEZOVOLUME – High volume piezoelectric thin film production process for microsystems

PIEZOVOLUME – High volume piezoelectric thin film production process for microsystems

Published 01 January 2010

The main concept of piezoVolume is to develop a platform of integrated processes for production of piezoelectric microsystems.

The platform will cover the complete microfabrication process chain and enable cost-effective medium and large scale production. A set of procedures, guidelines and tools will be developed, enabling short time to market for new device concepts. The capacity will be 2.5 Mio 1x1 cm devices per year from 10.000 200 mm wafers.

Readily available cost-effective wafer based batch processing of piezoMEMS lowers the threshold for industry acceptance of piezoMEMS and is enabling to realise new products based on piezoMEMS.

piezoVolume will provide:

  • Validated manufacturing procedures
  • Design handbooks and modelling tools
  • Application examples
  • Infrastructure for production and testing 

Funded under 7th FWP (Seventh Framework Programme)

For more information, see the project web page http://www.sintef.no/piezoVolume/

Senior Scientist

Project duration

01/01/2010 - 31/12/2012