Wafer-level Bonding using Anisotropic Conductive Adhesive for 3D MEMS Applications
Kategori
Sammendrag/abstract
Språk
Engelsk
Forfatter(e)
- Lars Geir Whist Tvedt
- Nicolas Lietaer
- Thor Bakke
- Keith Redford
- Helge Kristiansen
Institusjon(er)
- SINTEF Digital / Smart Sensors and Microsystems
- Conpart AS
År
2012Publisert i
IMAPS 8th International Conference and Exhibition on Device Packaging, Proceedings