Wafer-level Bonding using Anisotropic Conductive Adhesive for 3D MEMS applications
Kategori
Vitenskapelig foredrag
Språk
Engelsk
Forfatter(e)
- Lars Geir Whist Tvedt
- Nicolas Lietaer
- Thor Bakke
- Keith Redford
- Helge Kristiansen
Institusjon(er)
- SINTEF Digital / Smart Sensors and Microsystems
- Conpart AS
Presentert på
IMAPS 8th International Conference and Exhibition on Device Packaging
Sted
Scottsdale, Arizona
Dato
05.03.2012 - 08.03.2012
Arrangør
IMAPS