Al-Al Wafer-Level Thermocompression Bonding applied for MEMS
Kategori
Vitenskapelig foredrag
Oppdragsgiver
- Research Council of Norway (RCN) / 247781
- Research Council of Norway (RCN) / 210601
Språk
Engelsk
Forfatter(e)
- Maaike M. Visser Taklo
- Kari Schjølberg-Henriksen
- Nishant Malik
- Erik Poppe
- Sigurd Moe
- Terje Finstad
Institusjon(er)
- SINTEF Digital / Smart Sensors and Microsystems
- Universitetet i Oslo
Presentert på
5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D 2017)
Sted
Tokyo
Dato
16.05.2017 - 18.05.2017
Arrangør
The Univeristy of Tokyo (IEEE CPMT Society, JSPS)