A Novel Method for Depositing Patterned BCB using Spotter for Low Temperature Wafer Level Bonding
Kategori
Poster
Språk
Engelsk
Forfatter(e)
Institusjon(er)
- SINTEF Digital / Smart Sensors and Microsystems
Presentert på
MNE2019
Sted
Rhodes
Dato
23.09.2019 - 26.09.2019
Arrangør
45th International Conference on Micro and Nano Engineering