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Recent developments and future perspectives in 3D silicon radiation sensors

Sammendrag

In this paper we report on the most recent achievements of the ATLAS 3D Sensors Collaboration in the development of silicon 3D sensors. Results from 3D pixels production for the ATLAS Insertable B-Layer (IBL) are presented, showing the high quality and good process reproducibility of the technology. In view of the future detector upgrades at the LHC, a new generation of 3D pixel sensors will be developed. This will require some new ideas and the solution of technological challenges. Both will briefly be addressed in this paper.

Kategori

Vitenskapelig artikkel

Språk

Engelsk

Forfatter(e)

  • Gian-Franco Dalla Betta
  • Cinzia Da Via
  • M Povoli
  • Sherwood Parker
  • Maurizio Boscardin
  • Giovanni Darbo
  • Sebastian Grinstein
  • Philippe Grenier
  • Jasmine Hasi
  • Chris Kenney
  • Angela Kok
  • CH Lai
  • Giulio Pellegrini
  • Stephen Watts

Institusjon(er)

  • Università degli Studi di Trento
  • University of Manchester
  • University of Hawaii at Manoa
  • Fondazione Bruno Kessler
  • Istituto Nazionale di Fisica Nucleare
  • Institució Catalana de Recerca i Estudis Avançats
  • SLAC National Accelerator Laboratory
  • SINTEF Digital / Smart Sensors and Microsystems
  • Centro Nacional de Microelectrónica

År

2012

Publisert i

Journal of Instrumentation (JINST)

ISSN

1748-0221

Forlag

IOP Publishing

Årgang

7

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