Low-temperature bonding technologies for MEMS and 3D-IC
Kategori
Faglig foredrag
Oppdragsgiver
- Research Council of Norway (RCN) / 229945
- Research Council of Norway (RCN) / 210601
Språk
Engelsk
Forfatter(e)
- Maaike Margrete Visser Taklo
- Kari Schjølberg-Henriksen
- Nishant Malik
- Hannah Rosquist Tofteberg
- Erik Poppe
- David Oscar Vella
- Joshua Borg
- Zlatko Hajdarevic
- Armin Klumpp
- Peter Ramm
Institusjon(er)
- SINTEF Digital / Smart Sensors and Microsystems
- Universitetet i Oslo
- Ukjent
Presentert på
2014 4th IEEE International Workshop on Low Tempareture Bonding for 3D Integration
Sted
Tokyo
Dato
15.07.2014 - 16.07.2014
Arrangør
University of Tokyo