Oerlikon sputter tool
Measurements (XRD, SEM, profilometer, dielectric, ferroelectric and piezoelectric measurements) demonstrate that it is possible to deposit high quality piezoelectric PZT films onto 150 mm wafers with existing hardware and the developed process.
A process module has been used since the project started for the process development on 6’’ substrates. During the project a two-step process has been developed consisting of a PZT  nucleation and a volume growth phase. EPFL applied this process to deposit PZT onto Pt bottom electrodes covered with a chemical solution deposited lead titanate (CSD-PTO) or a sputtered titania (TiO2) seed layer. We may conclude that the process for the volume growth step will be the same for both seed layers, though the nucleation step has to be adapted for each type of seed layer.
Work is well under way to reproduce and fine-tune the processes for the 8” (200 mm) sputter equipment, currently located at the second project partner (ISIT) site. The next step is to define the optimum process with respect to the film quality, the capability for volume production and robustness to work with the 8” automatic tool.

Published April 10, 2012

The research leading to these results has received funding from the European Community's Seventh Framework Programme (FP7/2010-2013) under grant agreement n° 229196