The project has enabled aixACCT to build up a double beam laser interferometer tool (aixDBL) based on an automated wafer prober and has optimized the system in detail in order to achieve well documented, high-speed, 0.1% accuracy, to optimize thoughput and to develop a user-friendly, efficient interface including a graphics-based touch screen. More information on the tool is available on the aixACCT web-site.
The use of test-wafers that follow production batches is likely to be the preferred solution for production process monitoring and early-stage verification of the key piezoelectric thin film properties. This should be performed across whole wafers, and not be restricted to the use of statistical analysis as for point testing. Wafer mapping-techniques have been developed and used extensively for the development of the high volume deposition tools. The rapid, accurate mapping and characterization of simple test patterns across wafers reveals the true film quality, and in particular enables the user to determine the most critical thin film performance uniformity (on wafer-level) from batch-to-batch and to do this before the most complex and costly micromachining steps are performed on the device production batch.
8inch Wafer map of AlN wafer for reference measurement
Published March 27, 2012
World first fatigue results of displacement on thin films
Excellent stability on the DBLI system demonstrated over 6 month
The research leading to these results has received funding from the European Community's Seventh Framework Programme (FP7/2010-2013) under grant agreement n° 229196