Piezoelectric MEMS can fulfil many of the requirements of future smart devices:
  Low power requirements
  Small volume
  High performance
  Ease of manufacture

High quality PZT thin films has been fabricated and integrated successfully with silicon microsystems in low volume. Design, micromachining guidelines and validated procedures for deposition of PZT thin films were developed by the FP6 project MEMS-pie. The process is currently being offered as an MPW (multi-project wafer) service to interested parties under the name SINTEF moveMEMS and has attracted considerable interest. The process is however seriously restricted by throughput and cost due to time-consuming manual deposition (~100 wafers/year and 400 €/wafer µm). To our knowledge there are currently no other open piezoMEMS foundries currently available.

Tools for higher volumes are now requested by industry. piezoVolume will develop these tools and close this gap.

Through piezoVolume high throughput, cost-effective and robust manufacturing of piezoelectric microsystems will be made available to industry, both as tools and procedures that can be acquired but also as a source of piezoMEMS design and fabrication competence.

Published March 12, 2010


Ultrasonic microphone of Sonitor Technologies, used in connection with indoor positioning systems. The feasibility of such microphones has already been investigated using prototypes made by the low-volume SINTEF moveMEMS process

The research leading to these results has received funding from the European Community's Seventh Framework Programme (FP7/2010-2013) under grant agreement n° 229196