Reliability of TSV and wafer-level bonding for a 3D integrable SOI based MEMS application
Category
Academic lecture
Language
English
Author(s)
- Torleif Andre Tollefsen
- Maaike Margrete Visser Taklo
- Thor Bakke
- Nicolas Lietaer
- Per G. Dalsjø
- Jakob Gakkestad
Affiliation
- University of South-Eastern Norway
- SINTEF Digital / Smart Sensors and Microsystems
- Norwegian Defence Research Establishment
Presented at
International Wafer-Level Packaging Conference
Place
San Jose
Date
05.11.2012 - 08.11.2012
Organizer
SMTA and Chip Scale Review