Development of mechanically compliant flip chip interconnect using single metal coated polymer spheres
Category
Academic chapter/article/Conference paper
Language
English
Affiliation
- SINTEF Digital / Smart Sensors and Microsystems
- SINTEF Industry / Sustainable Energy Technology
Year
2019Publisher
IEEE conference proceedings
Book
2019 22nd European Microelectronics and Packaging Conference & Exhibition (EMPC)
ISBN
978-0-9568086-6-0