Development of mechanically compliant flip chip interconnect using single metal coated polymer spheres
Category
Lecture
Language
English
Affiliation
- SINTEF Digital / Smart Sensors and Microsystems
- SINTEF Industry / Sustainable Energy Technology
Presented at
European Microelectronics and Packaging Conference (EMPC2019)
Place
Pisa
Date
16.09.2019 - 19.09.2019
Organizer
IMAPS Italy