Abstract
The following sections are included:
•Introduction
•Through Glass Vias (TGVs)
•Through Silicon Vias
•Summary
•References
•Introduction
•Through Glass Vias (TGVs)
•Through Silicon Vias
•Summary
•References
Vertical Interconnects for High-End MEMS
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Category
Academic chapter/article/Conference paper
Client
- Research Council of Norway (RCN) / 247781
Language
English
Author(s)
- Sigurd Moe
- Maaike Margrete Visser Taklo
Affiliation
- SINTEF Digital / Smart Sensors and Microsystems
Year
2018Publisher
World Scientific
Book
MEMS Packaging
Issue
5
ISBN
978-981-3229-35-8
Page(s)
45 - 52