Copper Ink/Paste Considerations for the Formation of Interconnects
Category
Academic lecture
Language
English
Author(s)
- Richard N. Dixon
- Kerry Yu
- Astrid-Sofie Vardøy
- Maaike Margrete Visser Taklo
- Jonas Zürcher
- Thomas Brunschwiler
Affiliation
- Unknown
- SINTEF Digital / Smart Sensors and Microsystems
Presented at
The 20th European Microelectronics and Packaging Conference (EMPC)
Place
Friedrichshafen
Date
14.09.2015 - 16.09.2015
Organizer
IMAPS