Abstract
Piezoelectric thin films can meet the needs for actuation and sensing in micro electro-mechanical systems (MEMS). Even though piezoelectric films for MEMS have been prepared and used at a laboratory scale for many years there are few companies that offer this technology at an industrial scale. Industries that use piezoelectric thick film or bulk elements today see a need for smaller devices with improved functionality and reduced energy consumption. Thus, developers need a standardized piezoelectric film process that can deliver reliable and reproducible actuation for the next generation of MEMS devices. Transferring knowledge from laboratories to industrial production is indeed challenging. Reliability and reproducibility are crucial parameters that have to be addressed. This can be translated into e.g. device performance across a wafer and from wafer to wafer, lifetime, stability and yield. The challenges when integrating thin piezoelectric films into an industrial process will be presented together with parameter statistics. A system for automated poling and electrical testing of a whole wafer will also be presented.