Abstract
The paper presents the optical, mechanical, and electro-optical design of an interferometric inspection system for massive parallel inspection of Micro(Opto)ElectroMechanicalSystems (M(O)EMS). The basic idea is to adapt a micro-optical probing wafer to the M(O)EMS wafer under test. The probing wafer is exchangeable and contains a micro-optical interferometer array. Two preliminary interferometer designs are presented: a low coherent interferometer array based on the Mirau configuration and a laser interferometer array based on the Twyman-Green configuration. The optical design focuses on the illumination and imaging concept for the interferometer array. The mechanical design concentrates on a scanning system and integration in a standard test station for micro-fabrication. The smart-pixel approach for massive parallel electro-optical detection and data reduction is discussed.