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Dry-film resist technology for versatile TSV fabrication for MEMS, tested on blind dummy TSVs

Category

Academic chapter/article/Conference paper

Client

  • Research Council of Norway (RCN) / 210601

Language

English

Author(s)

Affiliation

  • SINTEF Digital / Smart Sensors and Microsystems

Year

2014

Publisher

EDA Publishing Association

Book

Symposium on Design, test, Integration & Packaging of MEMS/MOEMS, Cannes, France, 1-4 April, 2014

ISBN

9782355000287

Page(s)

351 - 355

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