Molecular Dynamics Simulation of Heat Transfer at Contact Interface of Hot Forming Die
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Category
Academic article
Language
English
Author(s)
- Baoshan Lu
- Leigang Wang
- Xiang Ma
Affiliation
- Jiangsu University
- SINTEF Industry / Metal Production and Processing
Year
2019Published in
IOP Conference Series: Materials Science and Engineering
ISSN
1757-8981
Publisher
IOP Publishing
Volume
627
Issue
1