Publications - SINTEF

Displays 1 - 7 of 7

Select references


2011 High Temperature Power Electronics Packaging View reference Larsson Andreas , Seip Torleif André Tollefsen , Storstrøm Olav Barros , Fallet Truls Source:iMAPS - 6th European Technology Workshop on Micropackaging and Thermal Management, La Rochelle, France, feb 02 - feb 03 Type:Presentation
2011 High Power Module Packaging Design for Harch Environments View reference Last ned Larsson Andreas , Storstrøm Olav Barros , Seip Torleif André Tollefsen , Taklo Maaike M Visser , Fallet Truls Source:7th International Conference and Exhibition on Device Packaging. Scottsdale, Arizona: International Microelectronics and Packaging Society (IMAPS). Type:Conference paper/Book chapter
2011 High Power Module Packaging Design for Harch Environments View reference Last ned Larsson Andreas , Storstrøm Olav Barros , Seip Torleif André Tollefsen , Taklo Maaike M Visser , Fallet Truls Source:7th International Conference and Exhibition on Device Packaging, Scottsdale, Arizona, mar 07 - mar 10 Type:Presentation
2011 Low Cost “Laserless” FTIR Spectrometer with Resolution Better Than 0.5 cm-1 View reference Haugholt Karl Henrik , Lacolle Matthieu Jean P , Bakke Kari Anne Hestnes , Tschudi Jon , Honne Atle , Storstrøm Olav Barros Source:Low Cost “Laserless” FTIR Spectrometer with Resolution Better Than 0.5 cm-1. Type:Conference paper/Book chapter
2011 Low Cost “Laserless” FTIR Spectrometer with Resolution Better Than 0.5 cm-1 View reference Haugholt Karl Henrik , Lacolle Matthieu Jean P , Bakke Kari Anne Hestnes , Tschudi Jon , Honne Atle , Storstrøm Olav Barros Source:FTS, OSA topical meeting, Toronto, jul 11 - jul 14 Type:Presentation
2010 Performance of a Thermal Management System for Thermophoresis Based Soot Sensors - Design, Performance and Verification View reference Larsson Andreas , Storstrøm Olav Barros , Seip Torleif André Tollefsen , Hjelstuen Magnus , Bjorklund Robert , Grant Ann , Fägerman Per Erik , Paaso Jaska , Lloyd Spetz Anita , Jozsa Peter , Johansson Mats L , Hammarlund L. Source:2010 IEEE Sensors, 1-4 Nov. 2010, Wakloloa. (s. 2377-2382). IEEE Computer Society. Type:Conference paper/Book chapter
2007 Long Term High Temperature Reliability of Aluminium Wire-Bonds to Thin Film, Thick Film and LTCC Substrate Metallizations View reference Johannessen Rolf , Oldervoll Frøydis , Strisland Frode , Storstrøm Olav Source:HITEN 2007, Oxford, UK, sep 17 - sep 19 Type:Presentation