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Source:2010 IEEE International 3D Systems Integration Conference (3DIC), Munich, Germany, 16-18 Nov. 2010. (s. 274-277). IEEE Computer Society.
Type:Conference paper/Book chapter
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Source:6th Trento Workshop on Advanced Radiation Detectors (3D and P-type Technologies), Trento, mar 02 - mar 04
Type:Presentation
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Source:Micromechanics and Micro systems Europe Workshop (MME), Tønsberg, Norge, jun 19 - jun 22
Type:Presentation
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Source:Micromechanics and Micro Systems Europe Workshop (MME), Tønsberg, Norway, jun 19 - jun 22
Type:Presentation
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Source:Proceedings of the 22nd Micromechanics and Microsystems Technology Europe Workshop. Vestfold University College.
Type:Conference paper/Book chapter
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Source:International Wafer Level Packaging Conference, October 3-6, 2011, Santa Clara. SMTA Press.
Type:Conference paper/Book chapter
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Kok Angela Chun Ying
,
Hansen Thor-Erik
,
Lietaer Nicolas
,
Summanwar Anand
,
Boscardin M
,
Dalla Betta G-F
,
Da Via C
,
Darbo G
,
Fleta C
,
Hasi J
,
Kenney C
,
Parker S. I.
,
Pellegrini G
Source:IEEE Nuclear Science Syposium and Medical Imaging Conference, Valencia, Spain, okt 23 - des 29
Type:Presentation
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Source:International Wafer Level Packaging Conference, Santa Clara, USA, okt 03 - okt 06
Type:Presentation
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Source:MME 2011: Proceedings of the 22nd Micromechanics and microsystems technology Europe workshop. (s. 326-329). Vestfold University College Tønsberg.
Type:Conference paper/Book chapter
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Source:Vertex 2010, Loch Lomond, Scotland, jun 07 - jun 12
Type:Presentation
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Source:The 5th Trento Workshop on 3D and p-type Sensors, Manchester, UK, feb 24 - feb 26
Type:Presentation
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Source:IEEE Transactions on Nuclear Science 57, 5, 2897-2905.
Type:Journal article
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Source:PoS - Proceedings of Science 22, -, 1-10.
Type:Journal article
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Source:IEEE 3DIC, Munich, Germany, jan 01 - des 31
Type:Presentation
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Source:Venice 3D-Detector Processing Meeting, Venice, jun 04 - jun 04
Type:Presentation
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Source:Invited Seminar Fermi National Accelerator Laboratory (Fermi Lab) FNAL, Batavia, IL, okt 21 - okt 21
Type:Presentation
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Source:3D-Processing Meeting, Geneve, nov 26 - nov 26
Type:Presentation
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