Publications by Taklo Maaike M Visser


2012 Handbook of Wafer Bonding View reference Ramm Peter , Lu James Jian-Qiang , Taklo Maaike M Visser Source:Germany: Wiley. Type:Book
2011 High Power Module Packaging Design for Harch Environments View reference Last ned Larsson Andreas , Storstrøm Olav Barros , Seip Torleif André Tollefsen , Taklo Maaike M Visser , Fallet Truls Source:7th International Conference and Exhibition on Device Packaging. Scottsdale, Arizona: International Microelectronics and Packaging Society (IMAPS). Type:Conference paper/Book chapter
2011 Anisotropic Conductive Adhesive for Wafer-to-Wafer Bonding View reference Taklo Maaike M Visser , Bakke Thor , Tofteberg Hannah Rosquist , Tvedt Lars Geir Whist , Kristiansen Helge Source:7th International Conference and Exhibition on Device Packaging, Scottsdale, Arizona, feb 07 - mar 10 Type:Presentation
2011 Interconnects based on metal coated polymer spheres for improved reliability View reference Last ned Taklo Maaike M Visser , Larsson Andreas , Aasmundtveit Knut , Kristiansen Helge Source:Smart System Integration 2011, Dresden, Germany, feb 22 - mar 23 Type:Presentation
2011 Anisotropic Conductive Adhesive for Wafer-to-Wafer Bonding View reference Last ned Taklo Maaike M Visser , Bakke Thor , Tofteberg Hannah Rosquist , Tvedt Lars Geir Whist , Kristiansen Helge Source:7th International Conference and Exhibition on Device Packaging. Scottsdale, Arizona. Type:Conference paper/Book chapter
2011 High Power Module Packaging Design for Harch Environments View reference Last ned Larsson Andreas , Storstrøm Olav Barros , Seip Torleif André Tollefsen , Taklo Maaike M Visser , Fallet Truls Source:7th International Conference and Exhibition on Device Packaging, Scottsdale, Arizona, mar 07 - mar 10 Type:Presentation
2011 TSV development for miniaturized MEMS acceleration switch View reference Lietaer Nicolas , Summanwar Anand , Bakke Thor , Taklo Maaike M Visser , Dalsjø Per Source:2010 IEEE International 3D Systems Integration Conference (3DIC), Munich, Germany, 16-18 Nov. 2010. (s. 274-277). IEEE Computer Society. Type:Conference paper/Book chapter
2011 Site-specific Failure Analysis and Reliability Testing of 3D Systems using “Plasma” FIB View reference Young R.J. , Rue C. , Routh R. , Franz G. , Kwakman L. , Ramm P. , Klumpp A. , Taklo Maaike M Visser Source:SEMATECH 3D Interconnect Metrology Workshop, San Francisco, USA, jul 13 - jul 13 Type:Presentation
2011 Electronic packaging for harsh environments View reference Last ned Taklo Maaike M Visser , Gakkestad Jakob , Sløgedal Øyvind , Larsson Andreas , Fallet Truls , Chan Matt Source:A seminar for the industry, presentations from two KMB projects, HiVe, nov 18 - nov 18 Type:Presentation
2011 Bonding and TSV in 3D IC Integration: Physical Analysis with a Plasma FIB View reference Taklo Maaike M Visser , Klumpp Armin , Ramm Peter , Kwakman Laurens , Franz German Source:Microscopy and Analysis 25 (7), 9-12. Type:Journal article
2011 Characterization and Failure Analysis of 3D Integrated Systems using a novel plasma-FIB system View reference Kwakman Laurens , Franz German , Taklo Maaike M Visser , Klumpp Armin , Ramm Peter Source:Proc. International Conference on Frontiers of Characterization and Metrology for Nanoelectronics. Grenoble, France. Type:Conference paper/Book chapter
2010 3D System-on-Chip technologies for More than Moore systems View reference Ramm Peter , Klumpp Armin , Weber Josef , Taklo Maaike M Visser Source:Microsystem Technologies : Micro- and Nanosystems Information Storage and Processing Systems 16, 7, 1051-1055. Type:Journal article
2010 Conductive adhesives increase microchip packaging density View reference Gakkestad, Jakob , Daljsø, Per , Kristansen, Helge , Johannessen, Rolf , Taklo Maaike M Visser Source:SPIE Newsroom. Type:Conference paper/Book chapter
2010 The European 3D Technology Platform (e-CUBES) View reference Ramm, Peter , Lietaer Nicolas , Raedt, Walter De , Fritzsch, Thomas , Hilt, Thierry , Couderc, Pascal , Val, Christian , Mathewson, Alan , Razeeb, Kafil M. , Stam, Frank , Klumpp, Armin , Weber, Josef , Taklo Maaike M Visser Source:6th International Conference and Exhibition on Device Packaging, Scottsdale, Arizona, USA, mar 09 - mar 11 Type:Presentation
2010 3D Integration of MEMS and IC : Design, Technology and Simulations. Advanced Processes and Materials View reference Taklo Maaike M Visser , Schjølberg-Henriksen Kari , Lietaer Nicolas , Prainsack Josef , Elfving Anders , Weber Josef , Klein Matthias , Schneider Peter , Reitz Sven Source:Advanced Materials and Technologies for Micro/Nano-Devices, Sensors and Actuators. (s. 191-203). Dordrecht: Springer. Type:Conference paper/Book chapter
2010 Technologies enabling 3D stacking of MEMS View reference Taklo Maaike M Visser , Mielnik Michal Marek , Schjølberg-Henriksen Kari , Storås Preben , Tofteberg Hannah Rosquist , Lietaer Nicolas , Johannessen Rolf Source:Smart System Integration and Reliability. Dresden: Goldenbogen verlag. Type:Conference paper/Book chapter
2010 3D Integration Technology: Status and Application Development View reference Last ned Ramm Peter , Klumpp Armin , Weber Josef , Lietaer Nicolas , Taklo Maaike M Visser , De Raedt Walter , Fritzsch Thomas , Couderc Pascal Source:40th European Solid-State Device Research Conference (ESSDERC), Sevilla, Spain, sep 13 - sep 17 Type:Presentation
2010 Use of Conductive Adhesive for MEMS Interconnection in Military Fuze Applications View reference Gakkestad Jakob , Dalsjø Per , Kristiansen Helge , Johannessen Rolf , Taklo Maaike M Visser Source:Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices IX. (s. paper no 75920I). SPIE - International Society for Optical Engineering. Type:Conference paper/Book chapter
2010 Use of Conductive Adhesive in Fuze Applications View reference Gakkestad Jakob , Dalsjø Per , Kristiansen Helge , Johannessen Rolf , Taklo Maaike M Visser Source:54th Annual Fuze Conference. Kansas City, USA. Type:Conference paper/Book chapter
2010 Use of Conductive Adhesive for MEMS Interconnection in Ammunition Fuze Applications View reference Gakkestad Jakob , Dalsjø Per , Kristiansen Helge , Johannessen Rolf , Taklo Maaike M Visser Source:Journal of Micro/Nanolithography 9, 4, 041108 (10 sider). Type:Journal article