The Advancement of Device Packaging – A Resume on IMAPS DPC 2017

Author(s)

• Peter Ramm
• Gilles Poupon
• Pascal Couderc
• Markus Leitgeb
• Maaike M. Visser Taklo

Affiliation

• Unknown
• SINTEF Digital / Smart Sensors and Microsystems

Issue

3

External resources

• https://www.imapsource.org/toc/amim/44/3