Low-Temperature Aluminum-Aluminum Wafer Bonding
Category
Academic lecture
Client
- Research Council of Norway (RCN) / 247781
Language
English
Author(s)
- Bernhard Rebhan
- Andreas Hinterreiter
- Nishant Malik
- Kari Schjølberg-Henriksen
- Viorel Dragoi
- Kurt Hingerl
Affiliation
- Unknown
- Johannes Kepler University Linz
- University of Oslo
- SINTEF Digital / Smart Sensors and Microsystems
Presented at
PRiME 2016/230th ECS Meeting
Place
Honolulu
Date
02.10.2016
Organizer
The Electrochemical Society