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Publications by Microsystems and Nanotechnology

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Source: Photonics West - OPTO, jan 27 - feb 01
Type: Presentation
Ræder Henrik, Tyholdt Frode, Dahl-Hansen Runar Plünnecke, Vogl Andreas, Bakke Thor, Rørvik Per Martin, Lapique Fabrice
Source: Piezo 2017 - Electroceramics for End-Users IX, feb 19 - feb 22
Type: Presentation
Source: 13th International Conference and Exhibition on Device Packaging (DPC), mar 07 - mar 09
Type: Presentation
Source: Gemini.
Type: Journal article
Source: Gemini (English edition).
Type: Journal article
Hansen Runar, Tyholdt Frode, Tybell Thomas
Source: Piezo 2017 - Electroceramics for end users IX, feb 19 - feb 22
Type: Presentation
Povoli Marco, Chartier Lachlan, Kok Angela, Lerch Michael L.F., Lye Øyvind, Morse John C, Pacifico Nicola, Petasecca Marco, Samnøy Andreas Tefre, Tran Linh T., Rosenfeld Anatoly B., Summanwar Anand
Source: TREDI - 12th Trento Workshop on Advanced Silicon Radiation Detectors, feb 20 - feb 22
Type: Presentation
Source: Silicon Photonics XII. SPIE - International Society for Optical Engineering.
Type: Conference paper/Book chapter
Gardner Dave, Hjelstuen Magnus, Fallet Truls, Kragset Steinar, Lohne Hans Petter, Husby Karsten, Hamou Faycal Riad, Stamnes Øyvind Nistad, Belle Branson
Source: SPE Bergen One Day Seminar, 2017. Society of Petroleum Engineers.
Type: Conference paper/Book chapter
Dahl-Hansen Runar Plünnecke, Tyholdt Frode, Tybell Per Thomas Martin
Source: Piezo 2017 Electroceramics for End Users IX, jun 19 - jun 22
Type: Presentation
Source:
Type: Report
Source: 8th Annual Workshop - Norwegian PhD Network on Nanotechnology for Microsystems, jun 12 - jun 14
Type: Presentation
Source: 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D 2017), mai 16 - mai 18
Type: Presentation
Goorsky M.S., Schjølberg-Henriksen Kari, Beekley Brett, Marathe N., Mani K., Bajwa A, Iyer S. S.
Source: 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D 2017), mai 16 - mai 18
Type: Presentation
Source: 2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D), Tokyo, 16-18 May 2017. (s. 11-11). IEEE.
Type: Conference paper/Book chapter
Malik Nishant, Venkatachalapathy Vishnukanthan, Dall Wilhelm, Schjølberg-Henriksen Kari, Poppe Erik Utne, Taklo Maaike M. Visser, Finstad Terje
Source: Superlattices and Microstructures 106, 216-233.
Type: Journal article
Source: Cutting Edge Business Insight, jan 21 - jan 21
Type: Presentation
Rebhan Bernhard, Hinterreiter Andreas, Malik Nishant, Schjølberg-Henriksen Kari, Dragoi Viorel, Hingerl Kurt
Source: ECS Transactions 75, 9, 15-24.
Type: Journal article
Rebhan Bernhard, Hinterreiter Andreas, Malik Nishant, Schjølberg-Henriksen Kari, Dragoi Viorel, Hingerl Kurt
Source: PRiME 2016/230th ECS Meeting, okt 02 - jan 01
Type: Presentation
Source: Geminiresearchnews.com, 08. nov
Type: Media contribution
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