Prosjekter
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Publikasjoner
- 2023 IMAPS Nordic Conference on Microelectronics Packaging (NordPac)
- Thermal management of MEMS element with thermoelectric-cooler
- Fabrication of a Silicide Thermoelectric Module Employing Fractional Factorial Design Principles Les publikasjonen
- Wafer bonding process for zero level vacuum packaging of MEMS Les publikasjonen
- Single digit parts-per-billion NOx detection using MoS2/hBN transistors Les publikasjonen
- Development of mechanically compliant flip chip interconnect using single metal coated polymer spheres
- Boron-doping of cubic SiC for intermediate band solar cells: a scanning transmission electron microscopy study
- Optical and microstructural investigation of heavy B-doping effects in sublimation-grown 3C-SiC
- Soldering of components onto a smart tag - an evaluation of the process window
- Bending machine for testing reliability of flexible electronics Les publikasjonen
Annen formidling
- Optimising thermal management of MEMS element with thermoelectric-cooler
- Silicide module produced in the TESil project
- NOx detection by MoS2/hBN heterostructures
- NOx detection by MoS2/hBN heterostructures
- Through Silicon Vias in MEMS packaging, a review Les publikasjonen
- Development of mechanically compliant flip chip interconnect using single metal coated polymer spheres
- Gas sensors based on 2D heterostructures
- Reliability of Conductive Adhesives for IoT
- Hygrothermal aging of flip-chip assembled MOEMS
- Bending Machine for Testing Reliability of Flexible Electronics