Maaike M Visser Taklo
Maaike M Visser Taklo
Publikasjoner og ansvarsområder
Hygrothermal aging of flip-chip assembled MOEMS
A flip-chip version of an optical MEMS (MOEMS) assembly is demonstrated in this work. A dummy MOEMS device is attached directly onto a traditional FR-4 board using a novel isotropic conductive adhesive (ICA) in order to minimize both fabrication costs and footprint of the assembly. The assembly solu...
Smart Tags that are exactly Reliable Enough
Smart tags for fast moving consumer goods are among the products predicted to be part of the Internet of Everything. The tags must be extremely low cost, be fabricated in huge volumes, and have a quality accepted by the end user. Screening tests have been performed to evaluate technologies for hybri...
Texture of Al films for wafer-level thermocompression bonding
Properties of aluminum thin films for thermocompression bonding have been studied in terms of surface roughness, grain size, and grain orientation by AFM, SEM, XRD and EBSD for thermocompression bonding. Al films were sputter deposited directly on Si and thermally oxidized Si wafers, respectively. T...
Cost-Efficient Wafer-Level Capping for MEMS and Imaging Sensors by Adhesive Wafer Bonding
Device encapsulation and packaging often constitutes a substantial part of the fabrication cost of micro electro-mechanical systems (MEMS) transducers and imaging sensor devices. In this paper, we propose a simple and cost-effective wafer-level capping method that utilizes a limited number of highly...
Anisotropic conductive film for fine-pitch interconnects
Use of silver-coated polymer particles in isotropic conductive adhesives for electronics applications
Comparison of hermetic sealing using SAC and SnPb solder for a MEMS pressure sensor
Reliability of Plastic Core Solder Balls in relation to formation of intermetallic compounds
The application of plastic core solder balls (PCSB) for the assembly of a silicon (Si) interposer die inside a ceramic package has been evaluated for a harsh application. Three different variants of assembly were compared. All variants survived the performed thermal shock cycling and centrifugation....