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Maaike M Visser Taklo

Sjefforsker

Maaike M Visser Taklo

Sjefforsker

Maaike M Visser Taklo
Telefon: +47 930 59 334
Mobil: +47 930 59 334
Avdeling: Smart Sensor Systems
Kontorsted: Oslo

Publikasjoner og ansvarsområder

Publikasjoner

Publikasjon

Hygrothermal aging of flip-chip assembled MOEMS

http://www.sintef.no/publikasjoner/publikasjon/?pubid=CRIStin+1458002

A flip-chip version of an optical MEMS (MOEMS) assembly is demonstrated in this work. A dummy MOEMS device is attached directly onto a traditional FR-4 board using a novel isotropic conductive adhesive (ICA) in order to minimize both fabrication costs and footprint of the assembly. The assembly solu...

Forfattere Taklo Maaike M Visser Wright Daniel Nilsen Kolberg Sigbjørn Vardøy Astrid-Sofie Hamou Faycal Riad Vogl Andreas Bakke Thor Kristiansen Helge Kalland Erik
År 2017
Type Presentasjon
Publikasjon

Smart Tags that are exactly Reliable Enough

http://www.sintef.no/publikasjoner/publikasjon/?pubid=CRIStin+1450852

Smart tags for fast moving consumer goods are among the products predicted to be part of the Internet of Everything. The tags must be extremely low cost, be fabricated in huge volumes, and have a quality accepted by the end user. Screening tests have been performed to evaluate technologies for hybri...

Forfattere Taklo Maaike M Visser Belle Branson Wright Daniel Nilsen Vardøy Astrid-Sofie Garcia Alexandre Eriksson Torbjörn Hagel Olle Danestig Magnus
År 2017
Type Konferanseartikkel/Bokkapittel
Publikasjon

Texture of Al films for wafer-level thermocompression bonding

http://www.sintef.no/publikasjoner/publikasjon/?pubid=CRIStin+1462979

Properties of aluminum thin films for thermocompression bonding have been studied in terms of surface roughness, grain size, and grain orientation by AFM, SEM, XRD and EBSD for thermocompression bonding. Al films were sputter deposited directly on Si and thermally oxidized Si wafers, respectively. T...

Forfattere Malik Nishant Venkatachalapathy Vishnukanthan Dall Wilhelm Schjølberg-Henriksen Kari Poppe Erik Taklo Maaike M Visser Finstad Terje
År 2017
Type Tidsskriftsartikkel
Publikasjon

Cost-Efficient Wafer-Level Capping for MEMS and Imaging Sensors by Adhesive Wafer Bonding

http://www.sintef.no/publikasjoner/publikasjon/?pubid=CRIStin+1392949

Device encapsulation and packaging often constitutes a substantial part of the fabrication cost of micro electro-mechanical systems (MEMS) transducers and imaging sensor devices. In this paper, we propose a simple and cost-effective wafer-level capping method that utilizes a limited number of highly...

Forfattere Bleiker Simon J. Taklo Maaike M Visser Lietaer Nicolas Vogl Andreas Bakke Thor Niklaus Frank
År 2016
Type Tidsskriftsartikkel
Publikasjon

Reliability of Plastic Core Solder Balls in relation to formation of intermetallic compounds

http://www.sintef.no/publikasjoner/publikasjon/?pubid=CRIStin+1383893

The application of plastic core solder balls (PCSB) for the assembly of a silicon (Si) interposer die inside a ceramic package has been evaluated for a harsh application. Three different variants of assembly were compared. All variants survived the performed thermal shock cycling and centrifugation....

Forfattere Taklo Maaike M Visser Wright Daniel Nilsen Graff Joachim Seland Carvalho Patricia Almeida Opsahl Hanne Olstad dalsjø Per G. Gakkestad Jakob Ishida Hiroya Johnsen Christian
År 2016
Type Presentasjon
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