Publikasjoner fra Tollefsen Torleif André


2013 High Temperature Power Electronics Packaging Vis referanse Larsson Andreas , Tollefsen Torleif André , Storstrøm Olav , Fallet Truls Kilde:(SINTEF rapport) Type:Rapport
2011 High Temperature Power Electronics Packaging Vis referanse Larsson Andreas , Seip Torleif André Tollefsen , Storstrøm Olav Barros , Fallet Truls Kilde:iMAPS - 6th European Technology Workshop on Micropackaging and Thermal Management, La Rochelle, France, feb 02 - feb 03 Type:Presentasjon
2011 High Power Module Packaging Design for Harch Environments Vis referanse Last ned Larsson Andreas , Storstrøm Olav Barros , Seip Torleif André Tollefsen , Taklo Maaike M Visser , Fallet Truls Kilde:7th International Conference and Exhibition on Device Packaging. Scottsdale, Arizona: International Microelectronics and Packaging Society (IMAPS). Type:Konferanseartikkel/Bokkapittel
2011 High Power Module Packaging Design for Harch Environments Vis referanse Last ned Larsson Andreas , Storstrøm Olav Barros , Seip Torleif André Tollefsen , Taklo Maaike M Visser , Fallet Truls Kilde:7th International Conference and Exhibition on Device Packaging, Scottsdale, Arizona, mar 07 - mar 10 Type:Presentasjon
2011 High temperature bonding technology for SiC devices – Au-Sn SLID Vis referanse Tollefsen Torleif André , Larsson Andreas , Knut Aasmundtveit Kilde:Berkeley Sensor and Actuator Center seminar, Berkeley, okt 25 - okt 25 Type:Presentasjon
2011 Au-Sn SLID bonding for harsh environments Vis referanse Tollefsen Torleif André , Larsson Andreas , Knut Aasmundtveit Kilde:Nano-network, Workshop, Oslo, jun 15 - jun 17 Type:Presentasjon
2011 Au-Sn SLID bonding for high temperature applications Vis referanse Tollefsen Torleif André , Larsson Andreas , Knut Aasmundtveit Kilde:IMAPS High Temperature Electronic Network Conference (HiTEN 2011, July 18-20, 2011, Oxford. (s. 58-67). iMAPS. Type:Konferanseartikkel/Bokkapittel
2011 Ball Grid Array (BGA) spheres Vis referanse Tollefsen Torleif André Kilde:Friday seminar Vestfold University College, Horten, apr 15 - apr 15 Type:Presentasjon
2011 Anisotropic conductive film for flip-chip interconnection of a high I/O silicon based finger print sensor Vis referanse Last ned Larsson Andreas , Oldervoll Frøydis , Tollefsen Torleif André , Nguyen Hoang-Vu , Kristiansen Helge , Sløgedal Øyvind Kilde:The 22nd Micromechanics and Micro systems Europe Workshop, Tønsberg, jun 19 - jun 22 Type:Presentasjon
2010 Performance of a Thermal Management System for Thermophoresis Based Soot Sensors - Design, Performance and Verification Vis referanse Larsson Andreas , Storstrøm Olav Barros , Seip Torleif André Tollefsen , Hjelstuen Magnus , Bjorklund Robert , Grant Ann , Fägerman Per Erik , Paaso Jaska , Lloyd Spetz Anita , Jozsa Peter , Johansson Mats L , Hammarlund L. Kilde:2010 IEEE Sensors, 1-4 Nov. 2010, Wakloloa. (s. 2377-2382). IEEE Computer Society. Type:Konferanseartikkel/Bokkapittel
2010 Bonding technology for rough environments Vis referanse Last ned Aasmundtveit Knut , Larsson Andreas , Lindgren Anders , Taklo Maaike M Visser , Kristiansen Helge , Nguyen Hoang-Vu , Tollefsen Torleif André Kilde:A seminar for the industry, presentations from two KMB projects, HiVe, des 03 - des 03 Type:Presentasjon
2010 High Temperature Electronic Packaging - novel design, failure mechanisms and material properties Vis referanse Seip Torleif André Tollefsen , Larsson Andreas , Løvvik Ole Martin , Knut Aasmundtveit Kilde:Nano-network, Workshop, Tønsberg, mai 31 - jun 02 Type:Presentasjon