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Smart Inspection System for High Speed and Multifunctional Testing of MEMS and MOEMS

Sammendrag

SMARTIEHS develops a major breakthrough in M(O)EMS testing innovative test concept parallel inspection of 100 M(O)EMS structures on the wafer level high-speed inspection measurement time can be reduced by a factor of 100 multi-functional approach exchangeable probing wafer enable a wide range of test parameters in the same instrument

Kategori

Vitenskapelig foredrag

Språk

Engelsk

Forfatter(e)

Institusjon(er)

  • SINTEF Digital / Smart Sensors and Microsystems
  • SINTEF Digital

Presentert på

MEMSWAVE 2008 RF-MST Workshop

Sted

Heraklion, Kreta

Dato

30.06.2008 - 30.06.2008

Arrangør

European Commision

År

2008

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